Printed Circuit Board

Printed Circuit Board the timeline 1903 Albert Hanson make a flat foil 99 1904 conductors which is laminated to an insulating board Thomas Edison, 1913 plates conductors into linen paper by using chemical method Max Schoop get the patent to flame-spray metal onto a board through a patterned mask, while Arthur Berry get the patent 1927 for print and etch method. 1936 A method to electroplating circuit patterns was acquired by Charles Durcase. Printed Circuit was invented by Paul Eisler while working on 8999 1943 a radio set. 1949 USA introduce a large scale Auto-Sembly process was invented by the US Army Signal Corps in which leads are inserted into a copper foil production of Printed Circuit for proximity fuses to be used for World War II. interconnection pattern and dip soldered. 1980's mid 1980's Through-hole component insertion has been slowly replaced by small surface mounting parts. The use of CAD software is becoming more and more common. 1998 Most PCB has used High speed/signal integration. 1998 The conductor width and spacing has been reduced to 35-40µm range with 75 .net Soldertools.net Soldertools