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Wafer Aligner Field Proven in HVM Operations

Wafer Aligner Field Proven In HVM Operations Features • Rotational Accuracy < 2 arc sec • Centration Accuracy < 0.002" (0.051 mm) Supports Transparent Substrates • Glass and Quartz • Plastic • Sic • Throughput of up to 450 WPH Standard Configurations Design Wafer Size Size Change Adjustment Single Axis Single CCD 100 mm to 300 mm Manual Single Axis Dual CCD 200mm and 300 mm Automatic Dual Axis 100 mm to 300 mm Automatic Single CCD Integrated Designs 50 mm to 300 mm Automatic and Manual • Small wafers: 50 mm to 100 mm Transparent Substrates Thin Wafer Options Edge Grip • Crown/Taiko Wafers Kensington LABORATORIES Kensington Labs Automation• Robotics Contact Kensingtonlabs Today For Technical Details and to Obtain A Quotation Email- [email protected] Contact No- 510.324.0126 Source Link -

Wafer Aligner Field Proven in HVM Operations

shared by kensingtonlabsus on May 19
The pre aligner technology is available in stand-alone units as well as integrated directly into robots. The alignment technology is used for opaque as well as transparent materials and the wafer alig...


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